AG-LDW-X8 system
Item Spec

Wafer half pitch size

130-65nm(mask)

Mask min feature image size

200nm

Mask OPC feature size, clear

160nm

Mask OPC feature size, opaque

100nm

Image placement

19nm

Wafer CD uniformity, binary

5nm

Mask design grid

4nm

Data Volume

1000 GB

The Image copy from TI
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