Semi-automatic Mask Aligner | M&R NANO TECHNOLOGY Semiconductor & Optoelectronic Process Equipment
Semi-automatic Mask Aligners are invaluable equipment in R&D labs, small-scale production lines, and new product development environments. Users typically face challenges such as inconsistent exposure quality, significant operational variations, and the need for improved alignment accuracy. Semi-automatic exposure machines, through programmed control of light source intensity, exposure time, and alignment, effectively reduce human error, ensuring consistent exposure results each time. They are a crucial tool for establishing standardized processes.
This Semi-automatic Mask Aligner features include a semi-automatic alignment system, programmable exposure parameters, stable light source output, and an intuitive user interface, while retaining the flexibility for manual adjustments. This allows engineers to quickly optimize conditions for new materials, photoresists, or structures. Compared to manual equipment, it significantly improves reproducibility and alignment accuracy; compared to fully automatic equipment, it offers greater cost-effectiveness and a shorter implementation cycle. Organizations choosing semi-automatic exposure machines are primarily MEMS development labs, optoelectronic device research, chip design and prototyping, startup process teams, or environments requiring small-batch, diverse processes. It can effectively solve problems such as insufficient exposure uniformity, unstable alignment, large process differences, and low experimental efficiency, and assist research and manufacturing teams in accelerating technology verification and improving yield. Choose M&R NANO TECHNOLOGY for high-quality semiconductor & optoelectronic process equipment and reliable customized manufacturing.
Semi-automatic Mask Aligner
Semi-automatic Mask Aligners are invaluable equipment in R&D labs, small-scale production lines, and new product development environments. Users typically face challenges such as inconsistent exposure quality, significant operational variations, and the need for improved alignment accuracy. Semi-automatic exposure machines, through programmed control of light source intensity, exposure time, and alignment, effectively reduce human error, ensuring consistent exposure results each time. They are a crucial tool for establishing standardized processes.
This Semi-automatic Mask Aligner features include a semi-automatic alignment system, programmable exposure parameters, stable light source output, and an intuitive user interface, while retaining the flexibility for manual adjustments. This allows engineers to quickly optimize conditions for new materials, photoresists, or structures. Compared to manual equipment, it significantly improves reproducibility and alignment accuracy; compared to fully automatic equipment, it offers greater cost-effectiveness and a shorter implementation cycle. Organizations choosing semi-automatic exposure machines are primarily MEMS development labs, optoelectronic device research, chip design and prototyping, startup process teams, or environments requiring small-batch, diverse processes. It can effectively solve problems such as insufficient exposure uniformity, unstable alignment, large process differences, and low experimental efficiency, and assist research and manufacturing teams in accelerating technology verification and improving yield.
Advantages of M&R's semi-automatic mask aligner
The core advantage of M&R's semi-automatic mask aligner lies in its combination of precise electric control and partial automation, resulting in a more stable and faster process. It is also easier for engineering teams to integrate into pre-mass production verification workflows, making it specifically designed for R&D units and pilot production lines requiring high precision, stability, and operational efficiency.
In terms of precision, the equipment uses a motorized XY/Z platform, providing control capabilities of 0.1µm on the XY axis and 1.0µm on the Z axis, achieving an alignment accuracy of 1.0µm. Combined with vision-based processing technology, this significantly improves exposure repeatability. Furthermore, the exposure resolution reaches up to 1.0µm, supporting high-precision process development.
To enhance exposure uniformity, the system incorporates WEC wedge error compensation technology, achieving a leveling accuracy of ±1.0µm. This effectively eliminates the effects of wafer surface tilt, ensuring consistent and stable exposure quality.
In terms of operational efficiency, this equipment offers partial automation, including auxiliary mechanisms for mask changing and wafer handling. This not only reduces operator workload but also improves throughput and operational safety. It is suitable for wafer sizes ranging from 2 inches to 8 inches.
Furthermore, the semi-automatic exposure machine supports multiple modes, including vacuum contact, hard contact, soft contact, and gap exposure, to meet various process conditions. It employs an IPC + PLC + HMI control architecture, coupled with a high-rigidity steel frame and a <2Hz vibration damping system, making overall operation more stable and reliable.
M&R's semi-automatic mask aligner combines high precision, reliability, and flexibility, effectively improving R&D efficiency and process quality, making it an important lithography equipment choice before mass production.
Specifications
- Applicable wafer size: 2”～8”
- XY travel: 10mm
- XY axis accuracy: motorized 0.1µm
- Z axis travel: >5.0mm
- Z axis accuracy: motorized 1.0µm
- Theta axis: Supports ±3° fine adjustment
- Leveling structure: WEC wedge error compensation
- Leveling accuracy: ±1.0µm
- Exposure resolution: 1.0µm
- Alignment accuracy: 1.0µm (motorized)
- Alignment method: vision-based alignment system
- Exposure modes: vacuum contact / hard contact / soft contact / gap exposure
- Control system: PLC + HMI + IPC
Configuration
- WEC leveling system
- High-rigidity vibration-damping steel frame
- Vision alignment system
- PLC + HMI + IPC control
Options
- Automated photomask changing system
- Automated wafer loading and unloading module
- Customized optical module
Applications
- Semiconductor photolithography process
- Optoelectronic devices (LED, Micro-LED)
- MEMS process
- Research units and pilot production lines
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Semi-automatic Mask Aligner Professional Custom Semiconductor & Optoelectronic Process Equipment
M&R NANO TECHNOLOGY provides high-quality Semi-automatic Mask Aligner and semiconductor & optoelectronic process equipment designed for advanced semiconductor, optoelectronic, and testing applications. Our product line includes detailed Mask Aligners, Spin Coaters, and Developers manufactured in our Taoyuan, Taiwan facility with strong automation capabilities.
We focus on delivering stable quality and precise customization through our in-house R&D and miniaturization technology. This ensures that every system meets strict process requirements while maintaining practical durability, low cost, and high efficiency for end-users.
For global buyers, M&R NANO TECHNOLOGY offers dependable manufacturing support that simplifies the sourcing process. We provide responsive communication, efficient automation integration, and consistent after-sales maintenance to help customers successfully bring their semiconductor & optoelectronic process equipment into production.