MCS Mask Cleaner System (Dry type) | M&R NANO TECHNOLOGY Semiconductor & Optoelectronic Process Equipment
The MCS Air-Knife Dust Removal System is an industrial-grade dry cleaning solution developed by M&R for applications requiring ultra-high cleanliness and contamination control. Utilizing high-speed air-knife airflow, the system effectively removes nano- and micro-scale particles in a fully non-contact process, making it particularly suitable for semiconductor photomasks, wafers, and other high-value precision components. Designed for seamless integration into advanced manufacturing environments, MCS helps reduce contamination risk, improve process yield, and enhance overall production stability without the use of water, chemicals, or solvents. Choose M&R NANO TECHNOLOGY for high-quality semiconductor & optoelectronic process equipment and reliable customized manufacturing.
MCS Mask Cleaner System (Dry type)
The MCS Air-Knife Dust Removal System is an industrial-grade dry cleaning solution developed by M&R for applications requiring ultra-high cleanliness and contamination control. Utilizing high-speed air-knife airflow, the system effectively removes nano- and micro-scale particles in a fully non-contact process, making it particularly suitable for semiconductor photomasks, wafers, and other high-value precision components. Designed for seamless integration into advanced manufacturing environments, MCS helps reduce contamination risk, improve process yield, and enhance overall production stability without the use of water, chemicals, or solvents.
Equipment Features
The MCS system employs a unique three-stage physical cleaning process, including electrostatic charge neutralization, air-transmitted ultrasonic vibration, and precision low-pressure M-shaped air-knife blowing. This design enables efficient removal of particles in the 0.5 to 5 micrometer range, achieving particle reduction rates of up to 99% while ensuring that sensitive pellicles and mask surfaces remain free from mechanical stress or deformation.
The system supports automated handling with robotic flipping, barcode and RFID identification, and SEMI E121 communication, allowing seamless integration with fab automation and mask logistics systems. These features make MCS an essential tool for advanced lithography environments, including EUV, ArF, and KrF processes, where cleanliness directly impacts yield, mask lifetime, and manufacturing reliability.
Specifications
- Main unit structure: High-strength steel/aluminum alloy frame
- Air knife: Wear-resistant metal alloy or high-grade aluminum alloy
- Airflow duct and nozzle: High-precision machined metal
- Controller and panel: Industrial-grade electronic components and panel
- Transmission mechanism: High-reliability servo or pneumatic drive
Configuration
- Main machine: Includes air knife module and drive air circuit
- Control system: PLC/touch panel, automatic parameter setting
- Air source interface: Compressed air supply and piping
- Safety/protection equipment: Emergency stop, safety shield, sensors
- Support frame/base: Can be integrated with production lines or transfer equipment
- Data monitoring interface: Displays operating status and dust removal statistics
Options
- High-precision positioning platform (dynamically integrated with production line)
- Particle size testing equipment
- Various air knife nozzles/cylinder modules
- Automatic feeding/unloading interface for production line
- Cleanliness monitoring system
- Integrated vacuum dust collection or emission piping
Applications
- Semiconductor photomask cleaning and dust removal (EUV, ArF, KrF grade photomasks)
- Precision wafer surface cleaning (MSP, wafer exposure)
- High-cleanliness manufacturing processes: such as optoelectronic processes, precision lens manufacturing
- Optical component processing: such as flat panel displays, optical glass
- Precision manufacturing environments: any environment requiring non-contact dust removal
Download Hot Products
MCS Mask Cleaner System (Dry type) Professional Custom Semiconductor & Optoelectronic Process Equipment
M&R NANO TECHNOLOGY provides high-quality MCS Mask Cleaner System (Dry type) and semiconductor & optoelectronic process equipment designed for advanced semiconductor, optoelectronic, and testing applications. Our product line includes detailed Mask Aligners, Spin Coaters, and Developers manufactured in our Taoyuan, Taiwan facility with strong automation capabilities.
We focus on delivering stable quality and precise customization through our in-house R&D and miniaturization technology. This ensures that every system meets strict process requirements while maintaining practical durability, low cost, and high efficiency for end-users.
For global buyers, M&R NANO TECHNOLOGY offers dependable manufacturing support that simplifies the sourcing process. We provide responsive communication, efficient automation integration, and consistent after-sales maintenance to help customers successfully bring their semiconductor & optoelectronic process equipment into production.