Automatic Spin Coater | M&R NANO TECHNOLOGY Semiconductor & Optoelectronic Process Equipment
Automatic Spin Coaters are renowned for their high stability and reproducibility in wafer coating processes, making them particularly suitable for mass production lines, R&D centers with stringent quality control, and applications requiring precise film thickness control. Their greatest advantage lies in their fully automated process, completing dispensing, acceleration, rotation, and drying, ensuring that each wafer is coated under completely consistent conditions. This significantly reduces film thickness variation and human error, optimizing coating uniformity.
The main reasons for choosing an automated spin coater include: the need for highly uniform films, increased production capacity, reduced operational burden, avoidance of film thickness deviations caused by unstable liquid volume and rotation speed, and the establishment of standardized, mass-producible coating processes. Compared to semi-automatic or manual equipment, it completely solves problems such as inconsistent film thickness, large experimental variations, and inaccurate manual dispensing. Applications cover photoresist coating, MEMS fabrication, optoelectronic materials, sensor fabrication, pre-packaging treatment, and nanofilm research. Overall, the automated spin coater achieves the optimal balance between high-quality requirements and mass production needs, making it a core piece of equipment for creating a stable and controllable coating process. Choose M&R NANO TECHNOLOGY for high-quality semiconductor & optoelectronic process equipment and reliable customized manufacturing.
Automatic Spin Coater
Automatic Spin Coaters are renowned for their high stability and reproducibility in wafer coating processes, making them particularly suitable for mass production lines, R&D centers with stringent quality control, and applications requiring precise film thickness control. Their greatest advantage lies in their fully automated process, completing dispensing, acceleration, rotation, and drying, ensuring that each wafer is coated under completely consistent conditions. This significantly reduces film thickness variation and human error, optimizing coating uniformity.
The main reasons for choosing an automated spin coater include: the need for highly uniform films, increased production capacity, reduced operational burden, avoidance of film thickness deviations caused by unstable liquid volume and rotation speed, and the establishment of standardized, mass-producible coating processes. Compared to semi-automatic or manual equipment, it completely solves problems such as inconsistent film thickness, large experimental variations, and inaccurate manual dispensing. Applications cover photoresist coating, MEMS fabrication, optoelectronic materials, sensor fabrication, pre-packaging treatment, and nanofilm research. Overall, the automated spin coater achieves the optimal balance between high-quality requirements and mass production needs, making it a core piece of equipment for creating a stable and controllable coating process.
Equipment Features
Equipment features include an automated dispensing system, programmable acceleration curves, high-precision motor control, closed-loop speed stability, a vacuum adsorption platform, and a sealed, clean coating chamber, allowing for precise control of film thickness from nanometer to micrometer levels. Even during continuous operation, they maintain high stability, unaffected by operator variations.
Advantages of M&R's Automatic Spin Coater
M&R's fully automated spin coater is a high-end process equipment specifically designed for industrial applications requiring precise coating of photoresist or process liquids, such as flat panel displays, printed circuit boards (PCBs), semiconductors, IC packaging, light-emitting diodes (LEDs), solar cells, electronic components, and optoelectronic components. The core function of this equipment is to achieve uniform coating of photoresist on wafers or substrates, while supporting multiple process functions to ensure high-quality and high-efficiency production line operation.</p>
<p>M&R's automated spin coater is designed with automation and high stability in mind. It is suitable for wafers or substrates ranging from 2 inches to 12 inches. Its structure utilizes corrosion-resistant and wear-resistant materials such as PP, SUS, PTFE, aluminum alloy, and PVC, ensuring the equipment's durability and process cleanliness.
In terms of key functions and configurations, M&R's fully automated spin coater achieves a fully automated process from pretreatment to baking:
- Wafer/Substrate Handling and Transfer: The equipment comes standard with an automated transfer arm, enabling the automatic transfer and reception of wafers or substrates from cassettes to the coating area. It features mapping capabilities, RFID readers, and wafer ID reading to ensure material traceability and process control.
- Coating and Baking: The core component incorporates a Hotplate + Coldplate module to perform soft baking before photoresist coating, hard baking after coating, or cooling steps required during the process, ensuring stable photoresist film thickness.
- Cleaning and Venting: The equipment integrates a DIW/N2 backspray and rotary cleaning system, a solvent/DIW spray cleaning module, and a separate developer mist elimination function to ensure a clean process and prevent particulate or chemical residues from affecting process quality.
- System Control: The equipment adopts a PLC + IPC control architecture and supports SECS/GEM communication interfaces, enabling streamlined and standardized control of the entire machine process and facilitating integration with factory management systems.
Through these comprehensive automation functions, the M&R fully automatic rotary coating machine not only significantly improves production efficiency but also ensures process stability, uniformity, and reproducibility through precise positioning and closed-loop control.
Specifications
- Applicable sizes: 2-inch to 12-inch chicks.
- Two spin coaters, rotary motors (10-6000 RPM).
- Chemical supply (photoresist, edge cleaner) back suction valve + nozzle spraying system.
- Cleaning (DIW, N2) back suction valve + nozzle spraying system.
- Waste liquid drainage system.
- Full-area HEPA EPA filter (compliant with Class 100), electrostatic eliminator, yellow light illumination, spin coater exhaust.
- Dual-arm wafer transfer arm + wafer edge inspection machine.
- Two cassette racks.
- Mapping function, RFID reader, wafer ID reader, interlock protection device.
- Hotplate + Coldplate.
- PLC + IPC control interface.
Configuration
- Two photoresist spin coating units (CHUCK for single wafer size).
- Photoresist spraying system (pressure tank supply).
- Wastewater discharge system (plant discharge).
- Interlock protection device, pressure tank level detection function, leak detector, EMO emergency safety button.
- Dual-arm wafer transfer arm + wafer edge inspection machine.
- Two open cassette racks.
- Mapping function, RFID reader, wafer ID reader, interlock protection device.
- Hotplate + Coldplate.
- PLC + IPC control interface, program log storage.
- Full-area HEPA filter (compliant with Class 100), electrostatic eliminator, warm light illumination.
Options
- Multiple sets of different sized CHUCK & centering fixtures.
- DIW, cleaning agent, N2 spraying system (pressure tank or plant supply).
- Edge washing and back washing spraying system (pressure tank or plant supply).
- Liquid backflow valve control (prevents dripping).
- Teflon CHUCK.
- Customized photoresist supply directly connects to customer PR bottles.
- Photoresist supply bottle weighing (monitors spray volume and remaining dosage).
- Equipment communication protocol SECS/GEM
Applications
- Flat panel displays
- Printed circuit boards (PCBs)
- Industries requiring photoresist coating, such as semiconductors, IC packaging, lithium batteries, and other electronic, optoelectronic, and energy storage applications.
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Automatic Spin Coater Professional Custom Semiconductor & Optoelectronic Process Equipment
M&R NANO TECHNOLOGY provides high-quality Automatic Spin Coater and semiconductor & optoelectronic process equipment designed for advanced semiconductor, optoelectronic, and testing applications. Our product line includes detailed Mask Aligners, Spin Coaters, and Developers manufactured in our Taoyuan, Taiwan facility with strong automation capabilities.
We focus on delivering stable quality and precise customization through our in-house R&D and miniaturization technology. This ensures that every system meets strict process requirements while maintaining practical durability, low cost, and high efficiency for end-users.
For global buyers, M&R NANO TECHNOLOGY offers dependable manufacturing support that simplifies the sourcing process. We provide responsive communication, efficient automation integration, and consistent after-sales maintenance to help customers successfully bring their semiconductor & optoelectronic process equipment into production.