Automatic Mask Aligner | M&R NANO TECHNOLOGY Semiconductor & Optoelectronic Process Equipment
Automatic Mask Aligners are indispensable equipment in mass production processes and high-precision R&D. Their greatest benefit lies in their ability to automate wafer pick-up, alignment, exposure, and unloading in a fully automated process, significantly improving throughput and process consistency. Through highly stable parallel light sources, a precise automatic alignment system, and programmed control, automated exposure machines ensure high consistency in linewidth, pattern edges, and exposure energy, helping process engineers effectively improve yield and reduce per-wafer variation.
Reasons for choosing automated mask aligners include: increased throughput, shorter process cycle time, ensuring consistent quality, reduced labor costs, and meeting the demands of high-precision processes. It is particularly suitable for scenarios such as chip mass production plants, MEMS manufacturing, optoelectronic components, sensors, repackaging and reassembly (RDL) processes, and startup mass production deployment. Overall, the automated mask aligner achieves process standardization with high efficiency, high precision, and high stability, making it a key equipment choice for moving from R&D to mass production. Choose M&R NANO TECHNOLOGY for high-quality semiconductor & optoelectronic process equipment and reliable customized manufacturing.
Automatic Mask Aligner
Automatic Mask Aligners are indispensable equipment in mass production processes and high-precision R&D. Their greatest benefit lies in their ability to automate wafer pick-up, alignment, exposure, and unloading in a fully automated process, significantly improving throughput and process consistency. Through highly stable parallel light sources, a precise automatic alignment system, and programmed control, automated exposure machines ensure high consistency in linewidth, pattern edges, and exposure energy, helping process engineers effectively improve yield and reduce per-wafer variation.
Reasons for choosing automated mask aligners include: increased throughput, shorter process cycle time, ensuring consistent quality, reduced labor costs, and meeting the demands of high-precision processes. It is particularly suitable for scenarios such as chip mass production plants, MEMS manufacturing, optoelectronic components, sensors, repackaging and reassembly (RDL) processes, and startup mass production deployment. Overall, the automated mask aligner achieves process standardization with high efficiency, high precision, and high stability, making it a key equipment choice for moving from R&D to mass production.
Equipment Features
Equipment features include a fully automated alignment platform, continuous batch processing, programmable exposure parameters, closed-loop light intensity stability control, and a clean, sealed operating environment, enabling it to maintain high stability even during long-term operation. Compared to semi-automatic or manual exposure, automated equipment completely eliminates human error, representing a critical upgrade for mass production-oriented processes.
Advantages of M&R's Automatic Make Aligner
The M&R's Automated Mask Algorithm is M&R's latest generation floor-standing exposure machine, designed specifically for medium to large-sized wafer processes. Supporting 2” to 12” wafers, its core value lies in "high-precision control × high automation × process stability." Supporting mass production of medium to large-sized wafers, it is a crucial piece of equipment for advanced lithography processes, specifically built for mass production processes that pursue high yield, high stability, and high efficiency.
In terms of precision, the equipment adopts a fully electric, high-precision XY/Z/Theta control platform. XY axis accuracy reaches 0.1µm, Z-axis displacement exceeds 5mm, and exposure resolution reaches 0.8µm. It integrates advanced vision computing technology, achieving alignment accuracy of 0.5–1.0µm, fully meeting the requirements for high-precision pattern transfer. M&R's automated mask aligner employs a high-rigidity steel frame structure combined with a vibration damping system to effectively reduce environmental interference and ensure process stability.
To ensure stability during long-term mass production, the automated mask aligner uses a high-rigidity steel frame with a <2Hz vibration damping system, significantly reducing external vibration interference. It incorporates WEC wedge error compensation leveling technology, achieving a leveling accuracy of ±1.0µm, effectively correcting wafer tilt and improving exposure uniformity. The mask fixing uses a high-locking dovetail design, further enhancing process stability.
In terms of efficiency, the equipment supports 2-inch to 12-inch wafers and can be optionally equipped with an automated mask changing system and a wafer robotic arm. Automated handling processes increase throughput and reduce human risk, making it ideal for mass production process requirements.
Furthermore, the system supports multiple exposure modes, including vacuum contact, hard contact, soft contact, and gap exposure, and is equipped with a PLC + IPC + HMI electronic control architecture, making the user interface intuitive and data management easy to integrate.
M&R's automated mask aligner, with its core features of high precision, high stability, and high efficiency, is a highly competitive automation equipment choice for various lithography mass production processes.
Specifications
- Applicable Wafer Size: 2”～12”
- XY Stroke: 5mm
- XY Axis Accuracy: Motorized 0.1µm
- Z Axis Stroke: >5.0mm
- Z Axis Accuracy: Motorized 1.0µm
- Theta Axis: Supports ±3° fine adjustment
- Leveling Structure: WEC Wedge Error Compensation
- Leveling Accuracy: ±1.0µm
- Mask Fixing: Dovetail design, extremely tight fit
- Mask Replacement: Semi-automatic / Manual
- Exposure Resolution: 0.8µm
- Alignment Accuracy: 0.5~1.0µm (Motorized)
- Alignment Method: Vision-based alignment system
- Exposure Modes: Vacuum contact / Hard contact / Soft contact / Gap exposure
- Control System: PLC + 7" HMI + IPC
Configuration
- WEC leveling system
- High-rigidity vibration-damping steel frame
- PLC + HMI + IPC control
Options
- Automated photomask replacement system
- Wafer robotic arm
- Customized optical modules
Applications
- Semiconductor photolithography process
- Optoelectronic devices (LED, Micro-LED)
- MEMS process
- Optical and laser devices
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Automatic Mask Aligner Professional Custom Semiconductor & Optoelectronic Process Equipment
M&R NANO TECHNOLOGY provides high-quality Automatic Mask Aligner and semiconductor & optoelectronic process equipment designed for advanced semiconductor, optoelectronic, and testing applications. Our product line includes detailed Mask Aligners, Spin Coaters, and Developers manufactured in our Taoyuan, Taiwan facility with strong automation capabilities.
We focus on delivering stable quality and precise customization through our in-house R&D and miniaturization technology. This ensures that every system meets strict process requirements while maintaining practical durability, low cost, and high efficiency for end-users.
For global buyers, M&R NANO TECHNOLOGY offers dependable manufacturing support that simplifies the sourcing process. We provide responsive communication, efficient automation integration, and consistent after-sales maintenance to help customers successfully bring their semiconductor & optoelectronic process equipment into production.