Manual Spin Coater | M&R NANO TECHNOLOGY Semiconductor & Optoelectronic Process Equipment
M&R's manual spin coater is used for photoresist and thin film material coating trials and process parameter establishment. Wafers are vacuum-adhesive fixed to a fixture, and centrifugal force generated by a motor rotation ensures the photoresist is evenly spread onto the substrate surface. The equipment body is made of chemical-resistant materials such as PP, PTFE, and aluminum alloy, capable of withstanding the wet processing environment of photoresist and pre-development stages, making it suitable for long-term R&D use. This equipment is particularly suitable for the early formulation and process condition exploration stages, allowing for rapid confirmation of coating behavior and film uniformity before automation, reducing trial production costs and establishing subsequent process standards.
Control methods are selectable according to requirements. The basic model offers two-stage speed and time control; the programmable version, equipped with a PLC and HMI, can record multiple process formulations and set the speed, time, and acceleration/deceleration flow for each step, facilitating process condition comparison and sample reproducibility verification. For large-size wafers, an automatic capping device can be added to reduce operational burden. Waste liquid extraction, leakage protection, emergency stop, and anti-misoperation designs can also be added to enhance operational safety. The equipment is commonly used for photoresist coating formulation development, initial NPI pilot production, optoelectronic and MEMS thin film process development, and front-end process teaching in academic and research institutions. It can be paired with manual exposure machines and benchtop developing machines to form a complete photoresist process workstation. Choose M&R NANO TECHNOLOGY for high-quality semiconductor & optoelectronic process equipment and reliable customized manufacturing.
Manual Spin Coater
M&R's manual spin coater is used for photoresist and thin film material coating trials and process parameter establishment. Wafers are vacuum-adhesive fixed to a fixture, and centrifugal force generated by a motor rotation ensures the photoresist is evenly spread onto the substrate surface. The equipment body is made of chemical-resistant materials such as PP, PTFE, and aluminum alloy, capable of withstanding the wet processing environment of photoresist and pre-development stages, making it suitable for long-term R&D use. This equipment is particularly suitable for the early formulation and process condition exploration stages, allowing for rapid confirmation of coating behavior and film uniformity before automation, reducing trial production costs and establishing subsequent process standards.
Control methods are selectable according to requirements. The basic model offers two-stage speed and time control; the programmable version, equipped with a PLC and HMI, can record multiple process formulations and set the speed, time, and acceleration/deceleration flow for each step, facilitating process condition comparison and sample reproducibility verification. For large-size wafers, an automatic capping device can be added to reduce operational burden. Waste liquid extraction, leakage protection, emergency stop, and anti-misoperation designs can also be added to enhance operational safety. The equipment is commonly used for photoresist coating formulation development, initial NPI pilot production, optoelectronic and MEMS thin film process development, and front-end process teaching in academic and research institutions. It can be paired with manual exposure machines and benchtop developing machines to form a complete photoresist process workstation.
Advantages of M&R's manual rotary coating machine
In R&D labs and teaching environments, researchers frequently utilize M&R's manual spin coaters for uniform coating of photoresists, nanomaterials, or thin films. They need to perform multiple parameter tests within a short timeframe to determine the optimal process conditions.
M&R's machine design emphasizes operational stability and spin control precision, enabling users to achieve highly reproducible coating results at a low cost. For initial development or experimental teaching, this equipment offers high operability and an intuitive interface, allowing students and researchers to clearly understand the relationship between spin speed, time, and coating thickness. For R&D engineers, it enables rapid small-scale sample coating, reducing the time and cost burden of using expensive automated equipment. M&R also provides customized fixtures and robust after-sales support, allowing the equipment to flexibly adapt to different wafer sizes and material requirements, making it a reliable and economical choice for education, materials research, and process development.
Specifications
- Fragments, 1-inch to 12-inch chills (including wafer centering fixtures).
- Rotary motors (10~6000 RPM).
- Waste liquid drainage system.
- Ventilation system.
- Interlock protection device.
- Two-stage timer control.
- PLC programmable control interface.
- Multi-stage recipe control.
Configuration
- A single-size CHUCK & centering fixture.
- Photoresist spraying system (pressure tank).
- EMO emergency safety button.
- Vacuum pump.
Options
- Tabletop or floor-standing type.
- Multiple sizes of CHUCK & centering unit.
- Waste liquid drainage system.
- Interlock protection device.
- Programmable PLC control, HMI interface.
- Multi-stage formula control (supports up to 100 formulas, 30 steps per formula).
- Ventilation system.
- Automatic cap opening device.
- Teflon CHUCK.
Applications
- Flat panel displays
- Printed circuit boards (PCBs)
- Semiconductors and IC packaging
- Industries requiring photoresist coating, such as lithium batteries, optoelectronics, and energy storage.
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Manual Spin Coater Professional Custom Semiconductor & Optoelectronic Process Equipment
M&R NANO TECHNOLOGY provides high-quality Manual Spin Coater and semiconductor & optoelectronic process equipment designed for advanced semiconductor, optoelectronic, and testing applications. Our product line includes detailed Mask Aligners, Spin Coaters, and Developers manufactured in our Taoyuan, Taiwan facility with strong automation capabilities.
We focus on delivering stable quality and precise customization through our in-house R&D and miniaturization technology. This ensures that every system meets strict process requirements while maintaining practical durability, low cost, and high efficiency for end-users.
For global buyers, M&R NANO TECHNOLOGY offers dependable manufacturing support that simplifies the sourcing process. We provide responsive communication, efficient automation integration, and consistent after-sales maintenance to help customers successfully bring their semiconductor & optoelectronic process equipment into production.