Semi-Automatic Spin Coater

The semi-automatic rotary coating machine

Semi-Automatic Spin Coater - The semi-automatic rotary coating machine
  • Semi-Automatic Spin Coater - The semi-automatic rotary coating machine
  • The semi-automatic rotary coating machine
  • The semi-automatic rotary coating machine

Semi-Automatic Spin Coater

A semi-automatic spin coater plays a key role in lithography processes by bridging the gap between the operational flexibility of manual spin coaters and the high integration of fully automatic coating systems. Its core advantage lies in balancing automation level, process stability, and investment cost. A semi-automatic spin coater uses centrifugal rotation to uniformly distribute photoresist dispensed onto wafer surfaces. Depending on configuration, the system can perform wafer cleaning, air-blow drying, edge bead removal, and backside rinsing, supplied either by the manufacturer or an external pressure tank.

By providing streamlined control and enhanced process functions, the semi-automatic spin coater offers an optimal balance between manual flexibility and full automation, making it an ideal solution for customers seeking stable processes with reasonable investment cost.

Advantages of M&R's semi-automatic spin coating machine

The core function of M&R's semi-automatic spin coater is to achieve uniform distribution of photoresist on wafers or substrates, and it also features diverse functions such as washing, cleaning, drying, and blow-drying. Through a sophisticated mechanical structure and control system, it ensures a high degree of process uniformity and stability.
M&R's semi-automatic spin coater boasts a robust and durable construction, utilizing acid and alkali resistant and corrosion-resistant materials (PP, SUS, PTFE, aluminum alloy, etc.). It is suitable for 1-inch to 12-inch wafers or substrates.

Regarding process specifications, M&R's semi-automatic spin coater features the following core functions and systems:

  • Spin Control: Equipped with a spin motor, achieving speeds from 10-8000 RPM.
  • Process Liquid Handling: Includes a built-in exhaust system, exhaust fan, and a comprehensive cleaning system, including solvent/DIW recovery and spray cleaning systems, and is equipped with a cleaning (DIW, N2) back-suction valve + nozzle spraying system to ensure process cleanliness.
  • Safety and Control: Features an interlock protection device and an EMO emergency safety button. The control system employs a PLC control architecture, capable of storing up to 100 process recipes, each with up to 30 steps.

Although designed semi-automatically, the equipment's functionality is highly optimized. Operators can access the system via HMI. The human-machine interface panel allows manual or formula-based selection of the process, controlling rotation speed, time, and acceleration/deceleration.

The equipment also offers a variety of optional accessories, including different sized chicks, various cleaning agent/DIW spraying systems, pressure sensors, etc.

M&R's semi-automatic spin coating machine, with its high precision, high stability, and streamlined process, meets the needs of small to medium-sized or R&D production lines requiring precise photoresist coating.

Specifications
  • Fragments, 1-inch to 12-inch chillers (including wafer centering fixtures).
  • Rotary motors (10-8000 RPM).
  • Chemical supply (photoresist, edge cleaner) back suction valve + nozzle spraying system.
  • Cleaning (DIW, N2) back suction valve + nozzle spraying system.
  • Waste liquid drainage system.
  • Ventilation system.
  • Interlock protection device.
  • PLC programmable control interface.
  • Multi-stage formulation control.
Configuration
  • A single-size CHUCK & centering fixture.
  • Photoresist spraying system (pressure tank).
  • Waste liquid drainage system.
  • Interlock protection device.
  • HMI control interface.
  • Multi-stage formula control (supports up to 100 formulas, 30 steps per formula).
  • Pressure tank level detection function.
  • EMO emergency safety button.
  • Vacuum pump.
  • Chemical backflow valve control (prevents dripping).
Options
  • Tabletop or floor-standing type.
  • Multiple sets of different sizes of CHUCK & centering fixtures.
  • Cleanser supply and spraying system.
  • DIW and N2 spraying systems.
  • Edge washing and back washing spraying systems.
  • Pressure tank supply or connection to plant supply of chemicals and DIW systems.
  • Exhaust system.
  • Automatic lid opening device.
  • Teflon CHUCK.
Applications
  • Flat panel displays
  • Printed circuit boards (PCBs)
  • Industries requiring photoresist coating, such as semiconductors, IC packaging, lithium batteries, and other electronic, optoelectronic, and energy storage technologies.

Semi-Automatic Spin Coater Professional Custom Semiconductor & Optoelectronic Process Equipment

M&R NANO TECHNOLOGY provides high-quality Semi-Automatic Spin Coater and semiconductor & optoelectronic process equipment designed for advanced semiconductor, optoelectronic, and testing applications. Our product line includes detailed Mask Aligners, Spin Coaters, and Developers manufactured in our Taoyuan, Taiwan facility with strong automation capabilities.

We focus on delivering stable quality and precise customization through our in-house R&D and miniaturization technology. This ensures that every system meets strict process requirements while maintaining practical durability, low cost, and high efficiency for end-users.

For global buyers, M&R NANO TECHNOLOGY offers dependable manufacturing support that simplifies the sourcing process. We provide responsive communication, efficient automation integration, and consistent after-sales maintenance to help customers successfully bring their semiconductor & optoelectronic process equipment into production.