Core Product Categories and Applications

Positive Film Photoresists:

• Thin Film Applications: The KL 5300 series is suitable for IC manufacturing, with a film thickness range of 0.2 – 2.0 µm and a resolution up to 0.55 microns. The KL 7000 series is an environmentally friendly positive film photoresist without PFAS.
• Thick Film Applications: The K-PRO™ series (5 – 25+ µm) are advanced thick film positive film photoresists designed for advanced packaging, bumping, TSV, and electroplating, featuring high sensitivity and metal compatibility. The KL 6000 series (2.5 – 12 µm) is also suitable for advanced packaging and can be developed without PEB (Post-Exposure Bake).
Negative Photoresists and Special Photoresists:

• Lift-Off: The APOL-LO 3200 series is designed for metal lift-off, creating beveled structures that facilitate metal layer removal. The KL IR series is an image-reversing photoresist, switchable between positive and negative modes for lift-off applications.
• Vertical Structures: The KL NPR series can form vertical sidewall structures with a single-layer thickness of up to 20 µm, exhibiting excellent thermal stability (withstanding 130°C), suitable for TSV, electroplating, and RIE etching.
• Permanent Materials: The HARE SQ™ series is an epoxy-based negative photoresist (2–100 µm). Due to its excellent chemical, mechanical, and thermal resistance, it is suitable for fabricating permanent microstructures such as MEMS, microfluidics, waveguides, and pixel walls, and can replace SU-8.
• Electron Beam Resist: HARP™ PMMA Series is designed for high-resolution electron beam direct writing lithography and is suitable for nanoscale patterning.